New 3D Chip Combines Computing, Information Storage

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Newest Information : New 3D Chip Combines Computing, Information Storage

At a time when pc chips’ capability to course of a glut of information is slowing, researchers, together with one among Indian origin, have developed a 3 dimensional (3D) chip to deal with the scenario.

Computer systems at present comprise a chip for computing and one other for information storage. As elevated volumes of information are analysed, the restricted price at which information may be moved between the chips is making a communication “bottleneck”.

The brand new prototype chip, detailed within the journal ‘Nature’, makes use of a number of nanotechnologies, along with a brand new 3D pc structure, to reverse this pattern.

“The brand new 3D pc structure gives dense and fine-grained integration of computing and information storage, drastically overcoming the bottleneck from transferring information between chips,” mentioned Subhasish Mitra, Professor at Stanford College.

The researchers built-in over a million resistive random-access reminiscence (RRAM) cells, a brand new sort of reminiscence storage, and two million carbon nanotube transistors for processing, making a dense 3D pc structure with interleaving layers of logic and reminiscence.

By inserting ultra-dense wires between these layers, the 3D structure guarantees to deal with the communication “bottleneck”.

“Logic comprised of carbon nanotubes may be an order of magnitude extra energy-efficient in comparison with at present’s logic comprised of silicon and, equally, RRAM may be denser, sooner and extra energy-efficient,” added Philip Wong from Stanford.

An enormous benefit to the discover is that the brand new chip is suitable with at present’s silicon infrastructure, each by way of fabrication and design.

“The expertise couldn’t solely enhance conventional computing, but it surely additionally opens up an entire new vary of functions that we are able to goal,” mentioned Max Shulaker, Assistant Professor at Massachusetts Institute of Technology.

Overview : New 3D Chip Combines Computing, Information Storage

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